This 5 g Speedex thermal paste offers a high level of performance and stability thanks to its unique high density micronized silver filling and thermally conductive ceramic particles improved.
This thermal paste plays an essential role in ensuring optimal contact between surfaces to facilitate heat transfer, which helps to maintain lower temperatures and prevent overheating. The presence of silver in the paste contributes to its superior thermal conductivity.
The thermal compound paste can be used on different electronic components such as processors, cpus, graphics cards, memory chips, heat sinks, chipsets, RAM memory modules, etc. So it is commonly used for PC and PS4.
Features:
- Silver thermal paste in syringe
- Absolute stability, does not separate and does not flow
- Quantity: 5 g
